The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Apr. 05, 2023
Denso Corporation, Kariya-city, JP;
Yuu Yamahira, Kariya-city, JP;
Masashi Masumoto, Kariya-city, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A first semiconductor component having a first semiconductor chip and a first heat sink and a second semiconductor component having a second semiconductor chip and a second heat sink are disposed in a cooler. The first semiconductor chip is smaller in size than the second semiconductor chip. A first heat conduction surface between the first semiconductor chip and the first heat sink is smaller in an area than a second heat conduction surface between the second semiconductor chip and the second heat sink. A first region of the cooler where the first semiconductor component is disposed has higher cooling performance than a second region of the cooler where the second semiconductor component is disposed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile