Integrated circuit device including a power rail

Abstract

An integrated circuit device includes: a substrate having a backside surface; a pair of fin-type active regions protruding from the substrate and defining a trench region in the substrate; a pair of source/drain regions disposed, one-by-one, on the pair of fin-type active regions, respectively; a device isolation film covering a sidewall of each of the pair of fin-type active regions and disposed in the trench region; a via power rail disposed between the pair of fin-type active regions and between the pair of source/drain regions, wherein the via power rail passes through the device isolation film in a vertical direction; a backside power rail passing through the substrate in the vertical direction and disposed at a position overlapping the via power rail, wherein the backside power rail is connected to the via power rail; and an air spacer disposed between the substrate and the backside power rail.