The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 11, 2024
Mitsubishi Electric Corporation, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Acquired in a data acquisition process is a test result of an electrical test performed on a plurality of semiconductor chips. The test result is associated with arrangement information of the plurality of semiconductor chips. In a cutting process, a semiconductor wafer is cut based on a base point set in the semiconductor wafer. Identified in an identification process is a non-defective semiconductor chip or a defective semiconductor chip in a semiconductor wafer on which cutting processing has been performed based on appearance information of the semiconductor wafer on which the cutting processing has been performed and the test result of the semiconductor wafer before the cutting processing. The semiconductor wafer on which the cutting processing has been performed includes two or more semiconductor chips. The appearance information is an image of a region including the base point.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile