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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12787695 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

May. 16, 2025

Modularized large-sized carrier

Applicant:

Gudeng Precision Industrial Co., Ltd., New Taipei City, TW;

Inventors:

Ming-Chien Chiu, New Taipei City, TW;

En-Nien Shen, New Taipei City, TW;

Yung-Chin Pan, New Taipei City, TW;

Cheng-En Chung, New Taipei City, TW;

PO-Ting Lee, New Taipei City, TW;

Wei-Chien Liu, New Taipei City, TW;

Assignee:

GUDENG PRECISION INDUSTRIAL CO., LTD., New Taipei City, TW;

Attorney:
Primary Examiner:

Orlando E Aviles

Assistant Examiner:

Sanjidul undefined Islam

Int. Cl.
CPC ...
H10P 72/10 (2026.01); B65D 21/02 (2006.01); B65D 21/08 (2006.01); B65D 25/10 (2006.01); B65D 47/32 (2006.01); H10P 72/00 (2026.01); H10P 72/30 (2026.01);
U.S. Cl.
CPC ...
H10P 72/127 (2026.01); B65D 21/0204 (2013.01); B65D 21/0213 (2013.01); B65D 21/0228 (2013.01); B65D 21/083 (2013.01); B65D 25/107 (2013.01); B65D 47/32 (2013.01); H10P 72/0402 (2026.01); H10P 72/18 (2026.01); H10P 72/1914 (2026.01); H10P 72/1926 (2026.01); H10P 72/3302 (2026.01); B65D 2205/02 (2013.01); B65G 2201/0235 (2013.01); B65G 2201/0297 (2013.01);
Abstract

A modularized large-sized carrier includes at least two body modules, at least one hermetic seal component and a back board. The body modules are connected to each other peripherally and arranged in a depth direction. The hermetic seal component surrounds junctions of the body modules. The back board is disposed behind the last one of the body modules. The modularized large-sized carrier overcomes existing carrier size limitations otherwise caused by injection molding machines and continuously expands in the depth direction to thereby enlarge the airtight storage space of the carrier.

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Chiu, Ming-Chien. (2026). Modularized large-sized carrier (U.S. Patent No. 12787695). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787695

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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