The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Oct. 10, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A chip ejecting apparatus may include: a wafer stage configured to receive a dicing tape and a plurality of chips attached to the dicing tape; an ejector under the wafer stage, the ejector configured to eject gas toward a lower surface of the dicing tape while being in a non-contact state with the dicing tape; an orthogonal robot under the wafer stage, wherein the ejector is on an upper surface of the orthogonal robot; and a controller configured to: control the orthogonal robot and the ejector to move up and down in a first direction; control the orthogonal robot to move in a second direction or a third direction; control the ejector to move in a spiral manner in the second direction and the third direction by controlling the orthogonal robot to move in the spiral manner; and control an ejecting pressure of the gas of the ejector.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile