The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Oct. 20, 2022
Applicant:

Asm Ip Holding, B.v., Almere, NL;

Inventors:

Gregory Deye, Phoenix, AZ (US);

Arun Murali, Tempe, AZ (US);

Frederick Aryeetey, Phoenix, AZ (US);

Caleb Miskin, Mesa, AZ (US);

Alexandros Demos, Scottsdale, AZ (US);

Assignee:

ASM IP Holding B.V., Almere, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 70/00 (2026.01); B05D 1/36 (2006.01); H10P 14/43 (2026.01); H10P 72/00 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 70/125 (2026.01); B05D 1/36 (2013.01); H10P 14/432 (2026.01); H10P 72/0432 (2026.01); H10P 72/7612 (2026.01); H10P 72/7618 (2026.01);
Abstract

A material layer deposition method includes supporting a substrate in a preclean module and exposing the substrate to a preclean etchant while supported within the preclean module. The substrate is transferred to a deposition module and exposed to an adsorbate while supported within the deposition module. A material layer is the deposited onto the substrate while supported within the deposition module subsequent to exposing the substrate to the adsorbate. Semiconductor processing systems and computer program products are also described.


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Quick Actions:

Deye, Gregory. (2026). Material layer deposition methods, semiconductor processing systems, and related computer program products (U.S. Patent No. 12787677). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787677

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