The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
May. 13, 2024
Boe Mled Technology Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing Boe Technology Development Co., Ltd., Beijing, CN;
Chao Liu, Beijing, CN;
Jing Wang, Beijing, CN;
Lili Wang, Beijing, CN;
Shanshan Feng, Beijing, CN;
Jingping Zhao, Beijing, CN;
Mingming Jia, Beijing, CN;
Sha Feng, Beijing, CN;
Mengqing Liu, Beijing, CN;
Huaimin Wang, Beijing, CN;
Ming Zhai, Beijing, CN;
Haiwei Sun, Beijing, CN;
Qi Qi, Beijing, CN;
BOE MLED TECHNOLOGY CO., LTD., Beijing, CN;
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., Beijing, CN;
Abstract
A driving substrate includes: a base substrate including first and second surfaces and side surfaces, at least one side surface being a selected side surface; a flexible film including a first region located on the first surface, a second region located on the second surface, and a bending region located between the first and second regions, the bending region including a first corner region, a second corner region and a side region; and a wiring layer, an electrode layer and a connection lead layer disposed in sequence on a side of the flexible film away from the base substrate. The wiring layer is located in the first region, the second region and the side region. The electrode layer includes first, second, third, and fourth electrodes. Each third electrode is electrically connected to a fourth electrode through the wiring layer. The connection lead layer includes first and second connection leads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile