The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Feb. 14, 2022
Aoi Electronics Co., Ltd., Takamatsu, JP;
Atsushi Kuroha, Kagawa, JP;
AOI ELECTRONICS CO., LTD., Kagawa, JP;
Abstract
The increase in manufacturing cost is suppressed and reliability of a semiconductor device is improved. A semiconductor deviceincludes a light emitting element, a light receiving element, and a die padmade of a conductive material. The die padincludes a first regionA and a second regionB having a thickness greater than that of the first regionA. The light receiving elementis provided on an upper surface of the first regionA so as to be electrically insulated from the die pad. The light emitting elementis provided on an upper surface of the second regionB via a conductive adhesive layerinside a thorough holeof the light receiving element. A position of an upper surface of the light emitting elementand a position of an upper surface of the light receiving elementcoincide within a range of 5 μm or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile