Intelligent liquid cooling of electronic devices by actively controlled manifolds

Abstract

A system configured for cooling electronic devices comprises a pair of opposing, active manifolds that control a flow of cooling liquid through pipes or through an immersion tank past the electronic devices. A controller detects and/or predicts localized hotspots and adjusts flow control devices associated with inlets and outlets of the manifolds to direct proportionately more cooling liquid to the hotspots. The flow control devices can be any combination of variable speed pumps and/or adjustable valves, vents, and/or baffles. Manifolds can be placed on two opposing sides of the devices, on four opposing sides, and/or above and/or below the devices. Temperatures proximate the devices can be measured by separate sensors and/or sensors integral to components of the electronic devices. Hotspots can be predicted by monitoring current flows, power flows, and/or voltages of the electronic devices, and/or inferred from network activity and/or from a workload queue.