The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
May. 11, 2023
Dic Corporation, Tokyo, JP;
Wataru Fujikawa, Takaishi, JP;
Norimasa Fukazawa, Takaishi, JP;
Hiroyuki Hagiwara, Takaishi, JP;
Rei Tamura, Takaishi, JP;
DIC CORPORATION, Tokyo, JP;
Abstract
The layered body includes a seed layer that serves as a base for plating and that can be formed using a simple and low-cost method capable of ensuring stable quality and preventing the occurrence of scratches on the plating seed layer due to contact with a coating apparatus during application and contact with conveyor rollers. The layered body can provide good adhesion between a support and a metal layer (metal plating layer) without roughening the surface of the support. The transfer layered bodies is produced by forming a plating seed layer containing a dispersant and an electrically conductive material on a temporary support, forming a resin layer on the plating seed layer, and then allowing functional groups in the plating seed layer and functional groups in the resin layer to react with each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile