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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12787176 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

Oct. 24, 2023

High-frequency module including an electronic component disposed on a mounting board, where the electronic component directly contacts a ground electrode

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takanori Uejima, Kyoto, JP;

Hiromichi Kitajima, Kyoto, JP;

Dai Nakagawa, Kyoto, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Benny T Lee

Int. Cl.
CPC ...
H05K 1/181 (2026.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0203 (2013.01); H05K 1/0206 (2013.01); H05K 1/0219 (2013.01); H05K 3/28 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface facing each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is connected to the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is connected to the second ground electrode.

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Uejima, Takanori. (2026). High-frequency module including an electronic component disposed on a mounting board, where the electronic component directly contacts a ground electrode (U.S. Patent No. 12787176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787176

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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