The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Sep. 05, 2023
Applicant:

Nvidia Corporation, Santa Clara, CA (US);

Inventors:

Elad Mentovich, Tel Aviv, IL;

Dongji Xie, Gilroy, CA (US);

Ron Chao, San Diego, CA (US);

Ryan Albright, Beaverton, OR (US);

Assignee:

NVIDIA CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/181 (2026.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0275 (2013.01); H05K 1/0293 (2013.01); H05K 3/1283 (2013.01); H05K 3/284 (2013.01);
Abstract

A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.


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Mentovich, Elad. (2026). Secure electronic component assembly (U.S. Patent No. 12787175). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787175

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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