The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Feb. 16, 2024
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Shusaku Shibata, Osaka, JP;

Takaya Kouchi, Osaka, JP;

Teppei Niino, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01R 12/71 (2011.01); H01R 13/02 (2006.01); H05K 1/05 (2006.01); H05K 1/181 (2026.01); H05K 3/28 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01);
Abstract

A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. The protruding portion covers the connecting portion. The protruding portion protrudes from the cover body portion.


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Shibata, Shusaku. (2026). Wiring circuit board (U.S. Patent No. 12787163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787163

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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