The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
May. 17, 2024
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0313 (2013.01); H05K 1/113 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10977 (2013.01);
Abstract
A circuit board is provided. The circuit board includes a substrate portion including at least one circuit wire, an adhesive layer disposed on a first side of the substrate portion, and a metal reinforcing layer disposed opposite to the substrate portion with respect to the adhesive layer, wherein the metal reinforcing layer includes a first surface which has a convex portion, and a second surface disposed opposite to the first surface.
Quick Actions:
Lee, Ho-Jae. (2026). Circuit board (U.S. Patent No. 12787157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787157
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile