The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Apr. 30, 2024
Murata Manufacturing Co., Ltd., Kyoto, JP;
Tsuyoshi Takakura, Kyoto, JP;
Masaaki Mizushiro, Kyoto, JP;
Satoshi Izumi, Kyoto, JP;
Ryuichiro Wada, Kyoto, JP;
Hiroki Yoshimori, Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Tadashi Nomura, Kyoto, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile