The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Sep. 25, 2024
Murata Manufacturing Co., Ltd., Kyoto, JP;
Hisanori Murase, Kyoto, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A high frequency module includes a mounting substrate and an IC chip. The IC chip includes a plurality of switches and a plurality of low noise amplifiers. The mounting substrate includes a first ground layer, a second ground layer, a first via conductor group, and a second via conductor group. The first ground layer has a plurality of slits. The plurality of slits include a first slit and a second slit. The first slit is arranged between a first via conductor and a third via conductor in a plan view from a thickness direction of a mounting substrate. The second slit is arranged between a second via conductor and a fourth via conductor in a plan view from the thickness direction of the mounting substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile