The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Oct. 28, 2021
Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;
Agneta Ljungbro, Bjärred, SE;
Emil Nylander, Lund, SE;
Per Ingelhag, Alingsås, SE;
Peter Melin, Lindome, SE;
Telefonaktiebolaget LM Ericsson (publ), Stockholm, SE;
Abstract
The present invention relates to a method () of producing a printed circuit board (), wherein the printed circuit board () comprises a first substrate (), a second substrate (), and a heat pipe tube () with an open end (). The method comprises the step of forming (S) a recess () in the first substrate (), placing (S) the heat pipe tube () in the recess () of the first substrate () such that the open end () is exposed, and laminating (S) the first substrate () and the second substrate () with the heat pipe tube () embedded in the recess () between the first substrate () and the second substrate (). The present invention also relates to a printed circuit board, a circuit board as well as a method for producing a circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile