The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Dec. 24, 2024
Applicant:

Shenzhen Shokz Co., Ltd., Shenzhen, CN;

Inventors:

Junjiang Fu, Shenzhen, CN;

Chaowu Li, Shenzhen, CN;

Peigeng Tong, Shenzhen, CN;

Assignee:

SHENZHEN SHOKZ CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/10 (2026.01); H04R 9/02 (2006.01); H04R 9/06 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1075 (2013.01); H04R 1/1008 (2013.01); H04R 1/105 (2013.01); H04R 9/025 (2013.01); H04R 9/06 (2013.01); H04R 2460/13 (2013.01);
Abstract

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a vibration panel. The housing component includes a core housing, a core cover plate, and a sealing film. The transducer device includes a support. The core cover plate and the sealing film are respectively provided with a first avoidance hole and a second avoidance hole allowing the vibration panel to be connected with the support. The sealing film is configured to seal an assembly clearance of the first avoidance hole. At least one of the vibration panel and the support is provided with a support end surface corresponding to a surrounding region of the second avoidance hole. The sealing film is fixed on the support end surface.


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Fu, Junjiang. (2026). Core modules and electronic devices (U.S. Patent No. 12786613). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12786613

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