Photonic chiplet packaging

Abstract

A system includes a first chiplet, a second chiplet, an electronic amplification module, and a converter module. The first chiplet includes, e.g., a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, an application specific integrated circuit (ASIC), or a data storage device. The second chiplet includes a photonic module having, e.g., optical switches, optical couplers, optical routers, optical splitters, optical multiplexers, optical demultiplexers, optical filters, optical modulators, optical phase shifters, lasers, optical amplifiers, optical-to-electrical signal converters, or electrical-to-optical signal converters. The electronic amplification module includes, e.g., a driver amplifier or a transimpedance amplifier, and configured to process electrical signals sent to or from the photonic module. The converter module converts signals between a first interface (for communicating with the first chiplet) and a second interface (for communicating with the electronic amplification module).