The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Nov. 07, 2024
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Yi-Gyeong Kim, Daejeon, KR;

Young-Su Kwon, Daejeon, KR;

Su-Jin Park, Daejeon, KR;

Young-Deuk Jeon, Sejong-si, KR;

Min-Hyung Cho, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 5/125 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03K 5/125 (2013.01); H04B 1/40 (2013.01);
Abstract

Disclosed herein is a high-speed I/O circuit for die-to-die interconnect for suppressing an overshoot and an undershoot. A data reception circuit includes a reception circuit configured to convert a reception signal received from an interconnect into a digital signal, a first clipper circuit configured to suppress an overshoot of the reception signal based on current extraction, and a second clipper circuit configured to suppress an undershoot of the reception signal based on current supply.


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Kim, Yi-Gyeong. (2026). High-speed i/o circuit for die-to-die interconnect for suppressing overshoot and undershoot (U.S. Patent No. 12785671). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12785671

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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