Thermal runtime prediction for electronic devices

Abstract

A method and system for predicting remaining thermal runtime in an electronic device is disclosed. The method involves obtaining the device's current processor power consumption and temperature sensor reading, selecting a predefined function relating temperature and time at that power level, determining the position of the current temperature on the function, calculating the time position for a shutdown temperature, and determining the time difference to estimate remaining runtime. In some examples, the functions are quadratic curves fitted to empirical time-temperature data collected at different processor power levels. In one embodiment, the prediction is implemented in augmented reality glasses and continuously adjusted using updated power and temperature data. The runtime prediction enables the device to warn the user prior to shutdown and perform graceful shutdown procedures. By accounting for diverse operating conditions, the method provides an accurate estimate of remaining time before the device reaches critical temperatures.