The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 13, 2023
Hitachi High-tech Corporation, Tokyo, JP;
Tooru Aramaki, Tokyo, JP;
Xicen Zhang, Tokyo, JP;
Yuki Kashiwagi, Tokyo, JP;
Joji Kono, Tokyo, JP;
Takefumi Kakinuma, Tokyo, JP;
Masataka Okayama, Tokyo, JP;
Go Saito, Tokyo, JP;
HITACHI HIGH-TECH CORPORATION, Tokyo, JP;
Abstract
A semiconductor device manufacturing system including a platform connected to a semiconductor manufacturing device via a network, and the semiconductor device manufacturing system further includes: a database server in which a device ID assigned to each of the semiconductor manufacturing devices and extension of data output from each of the semiconductor manufacturing devices are stored as a device master; a conversion connection device in which the data is acquired by accessing the device master based on authentication information of the network or authentication information of the platform; and a path setting device in which spontaneous data output from the semiconductor manufacturing device is blocked.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile