The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Aug. 05, 2024
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Eric Sebastian Schmidt, Heimsheim, DE;

Stefan Patrick Lindt, Ettlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/3185 (2006.01);
U.S. Cl.
CPC ...
G01R 31/318511 (2013.01);
Abstract

A method is for teaching a machine learning system to predict failure probabilities of chips on a wafer. The method is based on a prediction of final test yields depending on wafer-level test measurements by the machine learning system. The machine learning system predicts the failure probabilities of the chips depending on the wafer-level test measurements, and the predicted failure probabilities are aggregated to the predicted final test yields. The machine learning system is trained, such that a math difference between predicted final test yields and final test yields from a training data set is minimized. Differences between the predicted final test yields and final test yields from a training data set are minimized.


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Quick Actions:

Schmidt, Eric. (2026). Prediction of failure probabilities of chips of a wafer (U.S. Patent No. 12782439). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12782439

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