The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Apr. 10, 2023
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Keita Takeuchi, Kanagawa, JP;

Satoshi Yamamoto, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H10W 90/00 (2026.01); H10F 39/95 (2025.01);
U.S. Cl.
CPC ...
G01R 31/2851 (2013.01); H10W 90/00 (2026.01); H10F 39/95 (2025.01); H10W 90/792 (2026.01);
Abstract

Detecting defective joining parts between semiconductor substrates is disclosed. In one example, a semiconductor device includes a first semiconductor substrate and a second semiconductor substrate stacked and joined together, a connection line having a plurality of pairs of connection pads connected to each other with a joint surface between the substrates interposed therebetween, the connection line being routed from one of the first and second semiconductor substrates to the other alternately a plurality of times via the pairs of the connection pads, and a detection circuit configured to detect whether or not the connection line has failed.


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Takeuchi, Keita. (2026). Semiconductor device and electronic apparatus (U.S. Patent No. 12782421). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12782421

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