The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
May. 17, 2023
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Lin Wei, Yokkaichi, JP;
Hiroyuki Koyano, Yokkaichi, JP;
Yukitoshi Terasaka, Yokkaichi, JP;
Toshinari Kobayashi, Yokkaichi, JP;
Megumi Yamao, Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Abstract
A molded componentincludes an internal component module including a first molded part, solder parts, and a second molded part. Lead wires include a first lead wire and a second lead wire. The first molded part includes a partition having a first face and a second face. The first lead wire has a first exposed section on the first face, and the second lead wire has a second exposed section on the second face. The first lead wire and the second lead wire are located at positions not overlapping with each other in a plan view from a direction in which the first face is oriented or a direction in which the second face is oriented. The solder parts include a first solder part located on the first face and a second solder part located on the second face.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile