The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Feb. 13, 2024
Applicant:

Ngk Insulators, Ltd., Nagoya-City, JP;

Inventors:

Seiya Sawada, Komaki, JP;

Takeshi Sakuma, Nagoya, JP;

Yutaro Fumoto, Kasugai, JP;

Assignee:

NGK INSULATORS, LTD., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 7/10 (2006.01); F01N 3/28 (2006.01); F28D 21/00 (2006.01); F28F 1/42 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
F28D 7/106 (2013.01); F01N 3/2828 (2013.01); F28D 21/0003 (2013.01); F28F 1/424 (2013.01); F01N 2330/34 (2013.01); F28F 13/003 (2013.01);
Abstract

A honeycomb structure includes: an inner peripheral wall; an outer peripheral wall; and partition walls disposed between the inner peripheral wall and the outer peripheral wall, the partition walls defining a plurality of cells each extending from a first end face to a second end face. In a cross section orthogonal to an extending direction of the cells, the partition walls include one or more first partition walls extending in a radial direction. The inner peripheral wall and the outer peripheral wall have an average thickness of 0.1 mm or more, and a thickness variation coefficient of 1.0 or less, represented by the following equation (1):the thickness variation coefficient=a standard deviation of the thicknesses of the inner peripheral wall and the outer peripheral wall/an average thickness of the inner peripheral wall and the outer peripheral wall  (1).


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Sawada, Seiya. (2026). Honeycomb structure and heat exchanger (U.S. Patent No. 12782058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12782058

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