The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Mar. 13, 2023
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Tetsuaki Inada, Toyama, JP;

Junya Konishi, Toyama, JP;

Masaki Murobayashi, Toyama, JP;

Takeshi Yasui, Toyama, JP;

Takeo Sato, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/04 (2006.01); C23C 16/52 (2006.01); H10P 14/60 (2026.01); H10P 14/692 (2026.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/045 (2013.01); H01J 37/321 (2013.01); H01J 37/32449 (2013.01); H01J 37/32834 (2013.01); H01J 37/32522 (2013.01); H01J 37/32743 (2013.01); H01J 2237/182 (2013.01); H01J 2237/186 (2013.01); H01J 2237/188 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01); H10P 14/6309 (2026.01); H10P 14/6319 (2026.01); H10P 14/69215 (2026.01);
Abstract

According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel in which a substrate is processed; an outer vessel configured to cover an outer circumference of the process vessel; a gas flow path provided between the outer vessel and the outer circumference of the process vessel; an exhaust path in communication with the gas flow path; an adjusting valve configured to be capable of adjusting a conductance of the exhaust path; a first exhaust apparatus provided on the exhaust path downstream of the adjusting valve; a pressure sensor configured to measure an inner pressure of the outer vessel; and a controller configured to be capable of adjusting an exhaust volume flow rate of the first exhaust apparatus by controlling the first exhaust apparatus based on a pressure measured by the pressure sensor.


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Inada, Tetsuaki. (2026). Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium (U.S. Patent No. 12781348). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12781348

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