Ferrous alloy foil, manufacturing method therefor, and component using same

Abstract

The present invention addresses the problem of reducing the cause of etching failure or pinholes as much as possible in an extremely thin ferrous alloy foil that has a thickness of 10-30 μm and that is applied to a metal mask used for increasing the precision of an electronic component. In order to solve the abovementioned problem, the present invention provides a ferrous alloy foil that has a composition containing at most 0.150% of C, at most 2.00% of Si, at most 10.00% of Mn 2.00-50.00% of Ni, at most 19.00% of Cr, at most 0.20% of N, at most 0.030% of Al, at most 5.00% of Co, at most 0.0005% of Mg, at most 0.0005% of Ca, at most 0.01% of Ti, at most 0.035% of P, and at most 0.0300% of S, with the balance consisting of Fe and impurities. The amount of AlOis at most 30 mass % and the amount of MgO is at most 15 mass % with respect to the total mass of inclusions having a particle diameter of 2.00 μm or larger, and among the inclusions having a particle diameter of 2.00 μm or larger, the number ratio of inclusions having a particle diameter of no larger than 5.00 μm is 80.00% or higher.