The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Mar. 28, 2024
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Shinobu Yokokawa, Okaya, JP;

Shintaro Asai, Matsumoto, JP;

Hirofumi Hokari, Chino, JP;

Atsushi Yamada, Chino, JP;

Toshihiro Otake, Chino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 1/12 (2006.01); C08J 5/04 (2006.01);
U.S. Cl.
CPC ...
C08L 1/12 (2013.01); C08J 5/045 (2013.01); C08J 2301/12 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2205/16 (2013.01);
Abstract

The molding material of the present disclosure includes a cellulose fiber and a specific cellulose derivative in which a part of the hydrogen atoms constituting the hydroxy groups of cellulose is substituted with a chemical structure represented by the following formula (1) and another part of the hydrogen atoms is substituted with a chemical structure represented by the following formula (2), wherein the content of the cellulose fiber is 50 mass % or more and 70 mass % or less.


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Yokokawa, Shinobu. (2026). Molding material (U.S. Patent No. 12781027). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12781027

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