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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12780671 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

Jul. 26, 2022

Silica particle, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device

Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Naoko Sumitani, Tokyo, JP;

Tsutomu Yonemori, Tokyo, JP;

Eiji Dejima, Tokyo, JP;

Yasuhiro Kawase, Tokyo, JP;

Assignee:

Mitsubishi Chemical Corporation, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Amber R Orlando

Assistant Examiner:

Anastasia A. Kuvayskaya

Int. Cl.
CPC ...
C01B 33/18 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H10P 52/40 (2026.01);
U.S. Cl.
CPC ...
C01B 33/18 (2013.01); C09G 1/02 (2013.01); C09K 3/1409 (2013.01); H10P 52/402 (2026.01); C01P 2004/03 (2013.01); C01P 2004/54 (2013.01); C01P 2004/64 (2013.01); C01P 2006/80 (2013.01);
Abstract

An object of the present invention is to provide a silica particle, a silica sol containing the silica particle, and a polishing composition containing the silica sol, which prevent secondary aggregation, have excellent dispersion stability, and are suitable for polishing. The present invention relates to a silica particle in which an average value of a circularity coefficient measured by a field-emission scanning electron microscope is 0.90 or more, and a standard deviation of the circularity coefficient is 0.05 or less.

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Sumitani, Naoko. (2026). Silica particle, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device (U.S. Patent No. 12780671). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12780671

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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