Method for manufacturing curved surface support structure, and hemispherical resonator gyroscope

Abstract

One embodiment comprises: forming an annular recess on an upper surface of a lower wafer, and a stem having a tip higher than at a radially-outer-surface a generally center of the recess; forming first electrodes arranged on the radially-outer-surface; forming a sacrificial layer; forming second electrodes arranged on a bottom surface of an upper wafer; bonding the upper wafer and the lower wafer with the sacrificial layer in between; separating a radially outer portion, which is located at a radially outer side of the upper wafer relative to the second electrodes; vacuum heating the upper wafer, the lower wafer, and the sacrificial layer under a condition where a pressure in a cavity defined by the upper wafer, the lower wafer, and the sacrificial layer is different from an ambient pressure; and removing the sacrificial layer after the vacuum heating at the pressure different from the ambient pressure.