The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Dec. 20, 2022
Applicant:

Tsudakoma Kogyo Kabushiki Kaisha, Ishikawa-ken, JP;

Inventors:

Isao Nishimura, Ishikawa-ken, JP;

Yasuyuki Ishida, Ishikawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/38 (2006.01); B29C 35/08 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
B29C 70/384 (2013.01); B29C 35/0805 (2013.01); B29C 2035/0838 (2013.01); B29K 2105/0872 (2013.01);
Abstract

An automated fiber bundle placement apparatus is configured to lay a strip-like fiber bundle impregnated with a thermoplastic resin on a stacking surface on an upper side of a placement die by moving a placement head and by emitting a laser from an emitting device to deposit the fiber bundle on the stacking surface incompletely. The emitting device is configured to emit the laser toward the fiber bundle laid on the stacking surface to its surface that is a reverse side of its surface facing the stacking surface.


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Nishimura, Isao. (2026). Automated fiber bundle placement apparatus (U.S. Patent No. 12779793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12779793

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