The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Oct. 31, 2024
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Ryo Sato, Kanagawa, JP;

Yukuo Yamaguchi, Tokyo, JP;

Shuichi Hasegawa, Kanagawa, JP;

Tomoaki Kamagata, Kanagawa, JP;

Daiki Yamamoto, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/54 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4815 (2013.01); B29C 65/542 (2013.01);
Abstract

Multiple components are bonded to each other by assembling a first component, a second component, and an elastic component so that a first space and a second space separate from the first space are formed adjacent to the first component and the second component and the elastic component is accommodated in the first space in a compressed state, and filling the second space with a first molten resin to bond the first component and the second component.


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Quick Actions:

Sato, Ryo. (2026). Component bonding method and component assembly (U.S. Patent No. 12779790). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12779790

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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