The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Apr. 21, 2022
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Ryoya Terakawa, Saga, JP;

Hiroki Ota, Saga, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/30 (2012.01); B24B 37/04 (2012.01); B24B 37/12 (2012.01); B24B 37/20 (2012.01); H10P 52/00 (2026.01); H10P 90/00 (2026.01);
U.S. Cl.
CPC ...
B24B 37/30 (2013.01); B24B 37/042 (2013.01); B24B 37/12 (2013.01); B24B 37/20 (2013.01); H10P 52/00 (2026.01); H10P 90/129 (2026.01);
Abstract

A polishing head having a first annular member, a closing member, a membrane, and a second annular member situated under the membrane and having an opening which holds a work to be polished. A space, which is formed by closing the opening of the first annular member with the closing member and the membrane, is partitioned into an inside space and an outside space with an annular partition wall having a top annular connection part connected to the closing member and a bottom annular connection part connected to the membrane, the inside diameter of the bottom annular connection part of the annular partition wall is larger than the inside diameter of the second annular member, and the outer circumferential region of the setting position of the work to be polished is situated vertically under the top annular connection part of the annular partition wall.


Find Patent Forward Citations

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Terakawa, Ryoya. (2026). Polishing head, polishing device, and method of manufacturing semiconductor wafer (U.S. Patent No. 12779620). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12779620

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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