The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Jul. 17, 2024
Applicant:

Dreamwell, Ltd., Doraville, GA (US);

Inventor:

Christopher Francis Chunglo, Marietta, GA (US);

Assignee:

DREAMWELL, LTD., Doraville, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A47C 21/04 (2006.01); A47C 27/14 (2006.01); A47C 31/00 (2006.01); B32B 3/26 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01);
U.S. Cl.
CPC ...
A47C 21/046 (2013.01); A47C 27/14 (2013.01); A47C 31/007 (2013.01); B32B 3/266 (2013.01); B32B 5/022 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 2262/0276 (2013.01); B32B 2264/108 (2013.01); B32B 2307/302 (2013.01); B32B 2307/724 (2013.01); B32B 2307/726 (2013.01); B32B 2307/7376 (2023.05); B32B 2601/00 (2013.01);
Abstract

Mattress assemblies that provide reduced heat index during use include a moisture management layer, a thermally conductive layer and an underlying spacer layer and in direct contact with the thermally conductive layer. Optionally, the thermally conductive foam layer can be perforated and sandwiched between two high air flow layers having an air flow of at least 6 ft3/min. In some embodiments, the perforated thermally conductive layer can include slits connecting adjacent perforations in a linear direction, e.g., along length dimension of mattress assembly or along width dimension of mattress assembly, which act as expansion cuts to provide greater air flow and heat dissipation. Also, disclosed are processes for reducing the heat index in a mattress assembly.


Find Patent Forward Citations

Quick Actions:

Chunglo, Christopher. (2026). Mattress assembly with reduced heat index (U.S. Patent No. 12778308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12778308

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…