The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Aug. 28, 2023
Qualcomm Incorporated, San Diego, CA (US);
Aniket Patil, San Diego, CA (US);
Manuel Aldrete, Encinitas, CA (US);
Zhijie Wang, San Diego, CA (US);
Piyush Gupta, San Diego, CA (US);
Rajneesh Kumar, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
An integrated circuit (IC) device includes a substrate. The substrate includes a first side having a stepped configuration having a first surface that is elevated relative to a second surface. The first surface includes first solder resist openings (SROs), and the second surface includes second SROs. The IC device includes a first set of solder balls electrically connected to a first set of contacts in the first SROs. A solder ball of the first set of solder balls has a first characteristic dimension. The IC device also includes a second set of solder balls electrically connected to a second set of contacts in the second SROs. A solder ball of the second set of solder balls has a second characteristic dimension larger than the first characteristic dimension.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile