The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Jun. 28, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jihyun Lim, Suwon-si, KR;
Yoonyoung Jeon, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided is a semiconductor package including a first wiring structure, a second wiring structure disposed on the first wiring structure, an expanded layer electrically connecting the first wiring structure and the second wiring structure to each other, and including an expanded base layer and a plurality of via structures, a semiconductor chip disposed in the expanded layer and between the first wiring structure and the second wiring structure, and a buried capacitor structure including a plurality first through-holes spaced apart from each other that penetrate the expanded base layer adjacent to the semiconductor chip, and extend in a first horizontal direction along a side surface of the semiconductor chip, and a plurality of electrode layers disposed on sidewalls of the plurality of first through-holes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile