High voltage integrated circuit package with core

Abstract

Systems, structures, circuits, and methods provide integrated circuit (IC) packages or modules having a transformer initially fabricated without a core. First and second semiconductor dies are disposed on a lead frame or other substrate. First and second coils are configured to about an aperture region. A hole or aperture may be formed in the IC package in the aperture region so a core may be placed and received in the aperture at a later time, e.g., such as after testing. The core may be a soft ferromagnetic material, e.g., metal, ferrite, and/or or a moldable material. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The IC packages and modules may include various types of circuits; in some examples, IC packages or modules may include a galvanically isolated gate driver or other high voltage circuit.