The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Oct. 04, 2023
Semiconductor Components Industries, Llc, Scottsdale, AZ (US);
Jihwan Kim, Seoul, KR;
Seungwon Im, Bucheon, KR;
Oseob Jeon, Seoul, KR;
Hangil Shin, Incheon, KR;
Taekyun Kim, Bucheon, KR;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
A fan out package may include a plurality of semiconductor dies, each of the semiconductor dies including a first surface and a second surface opposite to the first surface. The fan out package includes a redistribution layer coupled to the first surface of each of the plurality of semiconductor dies, a dieback conductive member coupled to the second surface of each of the plurality of semiconductors dies, and an encapsulation material coupled to the plurality of semiconductor dies and the dieback conductive member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile