High integration substrate integrated with passive device, and production method therefor

Abstract

The present disclosure provides a base plate integrating passive devices and a method for manufacturing the same, which relate to the technical field of radio frequency devices. The base plate integrating passive devices of the present disclosure includes a substrate base plate and the passive devices disposed on the substrate base plate, the passive devices including at least an inductor, the inductor including a plurality of open ring portions arranged and connected in sequence in a direction away from the base plate, wherein an interlayer dielectric layer is disposed between the open ring portions disposed adjacently, and the open ring portions disposed adjacently are electrically connected through a first via hole penetrating the interlayer dielectric layer; orthographic projections of any two of the open ring portions on the substrate base plate at least partially overlap.