The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Oct. 23, 2023
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Mohit Arora, Austin, TX (US);

Deepak Vasant Kulkarni, Austin, TX (US);

Richard E. George, Santa Clara, CA (US);

Terry Eugene Richardson, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/576 (2013.01); H01L 23/573 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01);
Abstract

A chip package includes a package substrate and an integrated circuit (IC) die disposed on the package substrate. The IC dies includes a security asset. The chip package also includes a glass based shield selectively disposed on the IC die and above the security asset. The glass based shield is configured to block access to the security asset. In some embodiments, the chip package includes an oxide layer disposed between the glass based shield and the IC die. In some embodiments, the chip package includes a detection module and a wire connecting the detection module to the glass based shield. The detection module is configured to generate and send a serial bit stream to the glass based shield. The detection module is also configured to monitor for changes in the serial bit stream returning from the glass based shield. Changes detected in the serial bit stream indicates the glass based shield has been tampered.


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Arora, Mohit. (2026). Chip package with tamper prevention (U.S. Patent No. 12777942). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777942

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