Method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the same

Abstract

Provide is a method of splitting a semiconductor chip, the method including performing a back-end-of-line (BEOL) process including forming a plurality of chip areas on a semiconductor substrate, forming a splitting area, which separates the plurality of chip areas, on the semiconductor substrate, and forming a wire on a first surface of the semiconductor substrate, forming a cutout auxiliary layer in the splitting area of the first surface of the semiconductor substrate, and performing mechanical machining by bringing a mechanical machining device into contact with the cutout auxiliary layer, wherein the cutout auxiliary layer is adjacent to the plurality of chip areas.