The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Aug. 02, 2023
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Takanobu Ono, Kuwana Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 54/00 (2026.01); H10P 52/00 (2026.01); H10P 74/20 (2026.01);
U.S. Cl.
CPC ...
H10P 54/00 (2026.01); H10P 52/00 (2026.01); H10P 74/203 (2026.01);
Abstract

A position determining method according to the present embodiment is a position determining method of a wafer which has a plurality of singulated chips and which is pasted on a tape. In addition, the present position determining method includes irradiating, with light, the wafer which has a first cut mark provided between the chips and a second cut mark with a width that differs from a width of the first cut mark. Furthermore, the present position determining method includes receiving irradiated light at a position opposing an irradiation position of light across the wafer. In addition, the present position determining method includes determining a position of the wafer based on a width of received light having passed through the wafer.


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Ono, Takanobu. (2026). Position determining method and manufacturing method of semiconductor device (U.S. Patent No. 12777869). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777869

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