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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12777759 B1

PDFFull Text
Date of Patent:
Oct. 27, 2026

Filed:

Dec. 20, 2023

Wiring substrate, light-emitting device, and manufacturing methods thereof

Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Atsushi Hosokawa, Tokushima, JP;

Masaaki Katsumata, Anan, JP;

Eiko Minato, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:

MORI & WARD, LLP

Primary Examiner:

Jami Valentine Miller

Int. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/01 (2025.01); H10W 72/20 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/0362 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01); H10W 72/252 (2026.01); H10W 90/724 (2026.01);
Abstract

A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. The wiring portion includes a second conductive member containing copper particles. The second member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. A weight proportion of the small-sized particles in the first member is lower than a weight proportion of the small-sized particles in the second member.

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Hosokawa, Atsushi. (2026). Wiring substrate, light-emitting device, and manufacturing methods thereof (U.S. Patent No. 12777759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777759

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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