The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jul. 03, 2023
Applicant:

Tianjin Sanan Optoelectronics Co., Ltd., Tianjin, CN;

Inventors:

Zhiwei Wu, Tianjin, CN;

Yanyun Wang, Tianjin, CN;

Di Gao, Tianjin, CN;

Liguo Zhang, Tianjin, CN;

Weiping Xiong, Tianjin, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/815 (2025.01); H10H 20/01 (2025.01); H10H 20/82 (2025.01); H10H 20/824 (2025.01);
U.S. Cl.
CPC ...
H10H 20/815 (2025.01); H10H 20/013 (2025.01); H10H 20/82 (2025.01); H10H 20/824 (2025.01);
Abstract

A light-emitting device includes a semiconductor substrate, an epitaxial structure that has a first surface facing the semiconductor substrate and a second surface opposite to the first surface, and a transparent bonding structure that is disposed between the first surface and the semiconductor substrate. The transparent bonding structure has a first bonding surface facing the first surface of the epitaxial structure and a second bonding surface opposite to the first bonding surface, and has a slit extending from the first bonding surface toward the second bonding surface and terminating at a position that is a distance away from the second bonding surface. A method for manufacturing a light-emitting device is also provided.


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Wu, Zhiwei. (2026). Light-emitting device and method for manufacturing the same (U.S. Patent No. 12777745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777745

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