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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12777720 B1

PDFFull Text
Date of Patent:
Oct. 27, 2026

Filed:

Jun. 30, 2022

Array substrate with communicated vias, method for manufacturing same, and display panel

Applicants:

Fuzhou Boe Optoelectronics Technology Co., Ltd., Fuzhou, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Bin Lin, Beijing, CN;

Yang Wang, Beijing, CN;

Jinliang Wang, Beijing, CN;

Qiming Li, Beijing, CN;

Zhenyou Zou, Beijing, CN;

Zengrong Li, Beijing, CN;

Assignees:

FUZHOU BCE OPTOELECTRONICS TECHNOLOGY CO., LTD., Fuzhou, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorney:

XSENSUS LLP

Primary Examiner:

Caleb E Henry

Int. Cl.
CPC ...
H10D 86/60 (2025.01); G02F 1/1362 (2006.01); H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H10D 86/60 (2025.01); G02F 1/136295 (2021.01); H10D 86/441 (2025.01);
Abstract

Provided is an array substrate. The array substrate includes: a substrate, and a first electrode, a connecting electrode, and at least two insulating layers arranged on the substrate, wherein the first electrode is disposed on a side, proximal to the first electrode, of the at least two insulating layers, and the connecting electrode is disposed on a side, facing away from the substrate, of the at least two insulating layers; and at least two communicated vias are arranged in the at least two insulating layers, a size of a first via, most proximal to the substrate, in the at least two vias is less than sizes of other vias, and the connecting electrode is lapped with the first electrode via the at least two vias.

Find Patent Forward Citations

Lin, Bin. (2026). Array substrate with communicated vias, method for manufacturing same, and display panel (U.S. Patent No. 12777720). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777720

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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