The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Sep. 05, 2023
Applicant:

Lx Semicon Co., Ltd., Daejeon, KR;

Inventors:

Min Ho Jeon, Daejeon, KR;

Dam Ha, Daejeon, KR;

Assignee:

LX SEMICON CO., LTD., Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H10D 86/443 (2025.01);
Abstract

Disclosed herein is a chip on film package including a base film, output wiring disposed on the base film and extending along a first direction, an insulation layer overlapping at least a portion of the output wiring, an output pad portion defined as a region in which the output wiring is exposed without the insulation layer, a semiconductor chip mounted on the base film and electrically connected to the output wiring, and a protective layer disposed between the semiconductor chip and the output pad portion with respect to the first direction.


Find Patent Forward Citations

Quick Actions:

Jeon, Min. (2026). Chip on film package including protective layer and display device including the same (U.S. Patent No. 12777715). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777715

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…