The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Feb. 01, 2024
Applicant:

Hon Young Semiconductor Corporation, Hsinchu City, TW;

Inventors:

Liang-Ming Liu, Hsinchu City, TW;

Yan-Ru Chen, Hsinchu City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H10D 30/01 (2025.01); H10D 30/66 (2025.01); H10D 64/27 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 30/668 (2025.01); H10D 30/0297 (2025.01); H10D 64/513 (2025.01); H10D 62/8325 (2025.01);
Abstract

A semiconductor structure includes a substrate, a gate structure, a first oxide layer, and a second oxide layer. The substrate has a trench. An inclined surface and a bottom surface of the trench have an obtuse angle therebetween. The gate structure is located in the trench. A width of a bottom surface of the gate structure is less than a width of a top surface of the gate structure. A cross-sectional profile of the gate structure is inverted trapezoid. The first oxide layer is located between the gate structure and the substrate. The second oxide layer is located on the top surface of the gate structure.


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Liu, Liang-Ming. (2026). Semiconductor structure and manufacturing method thereof (U.S. Patent No. 12777675). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777675

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