The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Sep. 06, 2024
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Michael Clayton Hamilton, Santa Barbara, CA (US);

Bob Benjamin Buckley, Santa Barbara, CA (US);

George Earl Grant Sterling, Santa Barbara, CA (US);

Assignee:

GOOGLE LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/189 (2026.01); G06N 10/40 (2022.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); G06N 10/40 (2022.01); H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09327 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A signal line assembly can include a flex circuit board. The flex circuit board can include at least one first ground layer; at least one first dielectric layer disposed on an inner surface of the at least one first ground layer; and a plurality of first signal lines disposed on an inner surface of the at least one first dielectric layer. The flex circuit board can have a cutout section. The signal line assembly can include a film structure disposed in the cutout section. The film structure can include at least one second ground layer; at least one second dielectric layer; and a plurality of second signal lines respectively coupled to the plurality of first signal lines. The at least one second dielectric layer can have a thickness that is smaller than a thickness of the at least one first dielectric layer.


Find Patent Forward Citations

Hamilton, Michael. (2026). Thin-film components integrated onto flex circuit boards (U.S. Patent No. 12777590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777590

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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