The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jun. 07, 2024
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Chang-Kai Chu, Zhongli District, TW;

Chang-Hsien Chen, New Taipei City, TW;

Yi-Tang Chen, Xinzhuang, TW;

Bhyrav Mutnury, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 2201/09536 (2013.01);
Abstract

An information handling system includes a printed circuit board having first and second vias fabricated through the printed circuit board. The first via includes a first conductive metal plating and first and second via portions. The first via portion is connected to a first ground trace of the printed circuit board. The second via portion is connected to a first trace of a differential pair. The first and second via portions are formed in the first conductive metal plating. The second via includes a second conductive metal plating and third and fourth via portions. The third via portion is connected to a second ground trace the printed circuit board. The fourth via portion is connected to a second trace of the differential pair. The third and fourth via portions are formed in the second conductive metal plating.


Find Patent Forward Citations

Chu, Chang-Kai. (2026). Dual differential via design on a printed circuit board (U.S. Patent No. 12777576). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777576

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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